In a field where change and growth are inevitable, new problems of electronic packaging continually arise. Smaller and more powerful devices are prone to overheating, causing intermittent system failures, corrupt signals, lower MTBF and direct system failures. Since convection treatment is the route of calorie transfer that most engineers take to treat thermal problems, it is possible to gain as much understanding as possible about the underlying mechanisms of fluid movement.
The thermal design of electronic equipment is the only book that specifically addresses the formulas used by electronic thermal and packaging engineers. It presents calorie transfer equations related to polyalphaolefin (PAO), silicone oils, perfluorocarbons and silicate ester based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that will allow you to quickly solve any thermal engineering problem in electronic packaging.